Title:

CPES 2019

Conference theme
Printable Flexible Wearable Electronics Symposium
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CPES 2019
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Notes:

Flexible and hybrid electronics (FHE) enable hundreds of new applications in various verticals by adding intelligence to ordinary objects with unique form factors. FHE uses next-generation additive and manufacturing electronics technologies that can help all 2,000 electronics players in Canada, as these technologies can augment and improve ordinary objects including smart parts, wearable devices, smart building surfaces, new sensor technologies for cars, smart consumer products, retail displays and smart packaging. The possibilities are endless, and represent a $31.6B global market opportunity, according to IDTECHEX.

With the past three events taking place in Toronto, ON, CPES in 2019 will land in Bromont, Quebec – hotbed of the Canadian semiconductor industry, where significant investment in FHE is ongoing.

At CPES, industry leading Canadian and international speakers will explore all facets of FHE during the fifth annual CPES including flexible, stretchable, and 2D/3D printable electronics; smart textiles and wearables; and flex-integrated circuit technologies, software and applications.

To find out more, visit https://intelliflex.org/cpes2019/

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  1. Date
    16-17 May 2019
  2. Venue
    Domaine Chateau Bromont
  3. City
    Québec
  4. Country
    Canada
  5. URL
    https://intelliflex.org/cpes2019/
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